BOYD Solderable Nuts
" (145457)宝德冷板选择器
Boyd公司提供冷板选择器,专注于集成工程材料和热管理解决方案,旨在推动下一代创新。资料中未提供具体产品信息或技术细节。
BOYD CORPORATION-INDIANA ISO 9001:2008
Boyd Corporation Boyd South Carolina 595 Wilcox Avenue,Gaffney, South Carolina,29341 USA ISO/TS 16949:2009
BOYD DIE CUT ( WUXI) CO, LTD. ISO 9001:2008
BOYD TECHNOLOGIES (THAILAND) CO., LTD. ISO 14001:2015
BOYD TECHNOLIGIES (THAILAND) CO., LTD. ISO 9001:2015
Boyd Corporation 595 Wilcox Avenue,Gaffney, South Carolina 29341 USA IATF 16949:2016
Boyd Plastic & Metal Parts (Shenzhen) Co., Limited ISO 9001:2008
Boyd Plastic & Metal Parts (Shenzhen) Co., Limited ISO 14001:2004
This is to certify that Boyd Corporation 600 South McClure Road,Modesto, California 95357-0520 USA
Boyd 4700 Stalwart Drive Fairburn, GA 30213 ISO/TS 16949: 2009
This is to certify that Boyd Corporation 6136 NE 87th Avenue,Portland, Oregon 97220 USA ISO 14001:2004
BOYD DIE CUT (WUXI) CO,LTD. 8# XINDU ROAD WUXI-SINGAPORE INDUSTRIAL PARK, P,R.C ISO 14001:2004
This is to certify that Boyd Corporation 595 Wilcox Avenue,Gaffney, South Carolina 29341 USA ISO 9001:2015
Boyd Seals with Endura Tech Recreational VehicleOne Company, Many Solutions
Why Critical Application Manufacturers Insistupon Boyd Corp’s Perfluoroelastomer O-Rings
Leading semiconductor component manufacturers depend upon O-Rings.com by Boyd Corporation for specialized compounds and high performance sealing solutions.
Leading medical manufacturers depend upon O-Rings.com by Boyd Corporation for specialized compounds and high performance sealing solutions. TS16949 ISO13485 AS9100C ISO9001 ISO14001
Leading oil and gas component manufacturers depend upon O-Rings.com by Boyd Corporation for specialized compounds and high performance sealing solutions.TS16949 ISO13485 AS9100C ISO9001 ISO14001
Leading food processing and beverage dispensing equipment manufacturers depend upon O-Rings.com by Boyd Corporation for specialized compounds and high performance sealing solutions.TS16949 ISO13485 AS9100C ISO9001 ISO14001
Electronics O-Rings One Company, Many Solutions Leading electronics component manufacturers depend upon O-Rings.com by Boyd Corporation for specialized compounds and high performance sealing solutions.
可焊接压力窗口插件
本资料介绍了Windows Solderable Pressure Window Inserts的设计和应用。这些压力窗设计用于安装于法兰铸件或舱壁中,需准备符合特定公差的加工凹槽。安装时,可以使用软焊料或导电环氧树脂。若使用环氧树脂,需注意其温度特性,推荐使用Emerson and Cummings制造的Ecco-Bond 45C。资料还详细说明了软焊料和导电环氧树脂的安装步骤,并提供了不同型号窗口的尺寸和机械规格。
BOYD(宝德)热界面材料选型指南
Thermal Interface Materials (TIMs) are a critical portion to any effective thermal management system as they transfer heat between solid surfaces. Boyd provides a full array of thermal interface materials, from soft materials like gap fillers, phase change materials, and thermal grease to less compliant materials like thermal rubber pads, films, and thermally conductive hardware.
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BOYD(宝德)散热风扇和鼓风机选型指南
Boyd has hundreds of standard fan options including preassembled fan heat sink combinations. Boyd Fans and Blowers are easily paired with existing or custom heat sinks to improve the effectiveness of the thermal management solution.~~~~~~博伊德有数百个标准风扇选项,包括预装风扇散热器组合。博伊德风扇和鼓风机很容易与现有或定制的散热器配对,以提高热管理解决方案的有效性。
BOYD(宝德)合成材料选型指南
Recognised as a leader on the European market in the elastomers, cellular rubbers and expanded plastics sector, in recent years Grando has expanded its range of materials to include composites and thermoplastics. 作为弹性材料、海绵橡胶及泡沫塑料行业的欧洲市场领军企业,Grando 还在近些年内大大拓宽了自身的合成及热塑材料系列产品。
BOYD(宝德)橡胶和塑料产品选型指南
Boyd extruded rubber and plastic products are available in a wide variety of custom-designed materials, shapes and sizes to meet the needs of virtually any application. Capabilities include metal carriers, flocking, adhesive, fabric and other reinforcements into single and multi-extruded profiles.~~~~~~Boyd挤出橡胶和塑料产品有多种定制设计的材料、形状和尺寸,可满足几乎任何应用的需求。功能包括金属载体、植绒、粘合剂、织物和其他增强材料,可制成单层和多层挤出型材。
BOYD(宝德)板级散热产品选型指南
Boyd has the expertise to design and manufacture cooling solutions spanning the entire range of thermal efficiency and mechanical complexity. Experts at solving cooling challenges ranging from networking, telecom and consumer electronics, to power and biomedical devices.~~~~~~博伊德拥有设计和制造涵盖整个热效率和机械复杂性范围的冷却解决方案的专业知识。解决从网络、电信和消费电子产品到电力和生物医学设备等冷却挑战的专家。
BOYD(宝德)TRANSTHERM™热管理产品选型指南
Thermal Interface Materials (TIMs) are a critical portion to any effective thermal management system as they transfer heat between solid surfaces. Boyd provides a full array of thermal interface materials, from soft materials like gap fillers, phase change materials, and thermal grease to less compliant materials like thermal rubber pads, films, and thermally conductive hardware.~~~~~~热界面材料(TIM)是任何有效热管理系统的关键部分,因为它们在固体表面之间传递热量。Boyd提供了一系列完整的热界面材料,从间隙填充物、相变材料和导热脂等软材料到热橡胶垫、薄膜和导热硬件等不太柔顺的材料。
Lectro Shield EMI Shielding Selection Guide Catalog
BOYD(宝德)塑料挤压件&支撑部件选型指南
Boyd extruded plastic products are available in a wide variety of custom-designed materials, shapes and sizes to meet the needs of virtually an application. Capabilities include various colors, adhesives, and rigid or flexible materials made into single, dual and tri-extruded profiles and supporting accessories.~~~~~~Boyd挤出塑料产品有多种定制设计的材料、形状和尺寸,可满足实际应用的需求。功能包括各种颜色、粘合剂和刚性或柔性材料,可制成单、双、三挤压型材和支撑配件。
Lectro Shield EMI Absorbers
Boyd Heat Sink Fabrications Guide A Quick & Easy Guide to Choosing a Heat Sink
宝德散热器制造指南:选择散热器的快速简单指南
本文介绍了热沉的基本知识、制造工艺和选择指南。内容涵盖热沉的分类、不同制造工艺(如冲压、挤压、切割、粘合、折叠、铸造等)的特点和适用场景,以及热沉与热界面材料、风扇、热管和蒸汽腔等热管理技术的集成。文章强调了选择合适热沉对优化冷却性能的重要性,并提供了如何根据应用需求选择热沉的建议。
宝德企业电子
该资料主要介绍了 Boyd Corp 在电子行业中的专业领域和服务。内容包括环境密封件与垫片、电磁屏蔽、振动阻尼、热管理、空气流动管理、LED 交叉干扰、环境密封等。公司提供的服务涵盖模具橡胶、原材料专业知识、快速报价响应、持续支持从开发到生产等。此外,资料还列出了公司的认证、标准材料和公司网站信息。
宝德增材制造热管技术:介绍增材制造热管和即将上市的新型热解决方案
本文介绍了增材制造的散热管技术及其在航空航天、高端汽车和电动出行等领域的应用。Boyd公司利用激光粉末床熔融技术制造钛散热管,并集成了微尺度网格毛细芯结构。文章还涵盖了该技术在欧洲航天局(ESA)和创新英国(Innovate UK)资助的研发项目中的发展情况。此外,文章还介绍了其他定制化的热管理解决方案和技术,如超薄蒸汽腔、真空钎焊液体冷板技术和封装石墨技术。
高性能数据中心液冷解决方案
宝德(Boyd)提供高性能数据中心液冷解决方案,包括液冷板、机架歧管、液体回路、泄漏检测器等组件。其高可靠性无泄漏架构和全球制造能力,使其成为数据中心液冷方案的首选。宝德提供多种CDU(冷却剂分配装置)和液体冷却回路,支持新数据中心建设和现有设施改造。
Boyd’s Liquid Cooling Solutions for Electric Vehicles: Creating Competitive Advantage in eMobility Applications
EPOSOLDER 6510-环氧银导电胶
Eposolder 6510是一种单组分、银填充的导电环氧胶粘剂,专为电子应用设计。它具有优异的电导率和热导率,适用于无铅解决方案,可替代传统焊料,提供更细的间距,并具有EMI/RFI屏蔽功能。
EPOSOLDER 6763-环氧树脂导电胶
Eposolder 6763是一种环氧基导电粘合剂,适用于电子领域,具有有效的电导率和热导率,适用于替代焊料、电气连接、导电、接地或EMI/RF屏蔽应用。
EPOSOLDER 6522-柔性导电胶
Eposolder 6522是一种柔性导电环氧树脂胶,适用于电子应用。它具有优异的电导率和热导率,适用于低应力焊接、连接和导电应用,如传感器、滤波器、晶振、MEMS、LCD驱动IC、CCD芯片附着、晶圆层压等。
EPOSOLDER 6869高导热性导电胶
Eposolder 6869是一种具有高导热性的电导粘合剂,适用于电子封装中的低应力焊接、连接和导电应用。该产品具有优异的电气和热导率,适用于航空航天、汽车电子、半导体和电信等领域。
UDDM封装24引脚塑料侧可焊QFN(3mm×5mm)
本资料详细描述了一种UDDM Package 24-Lead Plastic Side Solderable QFN(3mm×5mm)的封装设计。内容包括封装尺寸、引脚长度、焊盘尺寸和间距等关键参数。此外,还提供了封装的底部视图和推荐焊盘尺寸,并强调了对非焊接区域的涂覆要求。
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